Optimization of Measurement Parameters for Wafer Bonding Interface Strength Based on Internet of Things

CHEN Shubin, XU Huansu

Technology of IoT&AI ›› 2025, Vol. 57 ›› Issue (5) : 38-41.

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PDF(1123 KB)
Technology of IoT&AI ›› 2025, Vol. 57 ›› Issue (5) : 38-41.

Optimization of Measurement Parameters for Wafer Bonding Interface Strength Based on Internet of Things

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 57(5): 38-41

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